MEMS

Dai Nippon Printing (DNP) has provided MEMS foundry service since 2001.

FEATURE

DNP has provided MEMS foundry service since 2001.

  • DNP is able to support comprehensive foundry service, including design, trial production and mass production.
  • We stand in neutral position among MEMS foundries for any customers.
  • Manufacturing equipment is focused on MEMS production, which is available for either 6" or 8" wafers. Any requests for single or/ and partial MEMS processes are acceptable.
  • Our foundry service is able to provide photo-mask in collaboration with photo-mask manufacturing section in DNP.
  • We are able to support wide varieties of deep reactive ion etching (Deep-RIE) recipe.
  • It is available for electro Cu plating for TSV with high aspect ratio.

TECHNOLOGIES

EQUIPMENT

deposition

  • sputter
  • EB-evaporation
  • LP-CVD
  • PE-CVD

furnace

  • oxidization (wet, dry)
  • annealing

dry-etching

  • Deep-RIE
  • RIE (ICP、CCP)
  • asher

dry-etching

  • spin / spray coater
  • both sides alignment exposure
  • i -ray stepper exposure
  • developer (paddle、spray)

wet-etching

  • Si-crystal anisotropic etcher
  • metal etcher
  • organic film etcher
  • thermal phosphorus acid etcher

wet process

  • electro-plating
  • wafer cleaning
  • resist remover
  • fluoride carbon film remover

post process

  • anodic bonder
  • dicer

measuring

  • CD-SEM、review-SEM
  • microscope (optical, laser, both sides)
  • 3D laser measuring machine
  • surface profiler
  • spectrometric film thickness measurement system
  • total X-ray fluorescence spectrometer
  • ellipsometer
  • wafer-bow measurement system
  • spreading resistance profiler
  • prober
  • surface inspection system

design&analysis

  • MEMS design / analysis soft
  • electromagnetic field simulator

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